| Tape No. | Overall Thickness (mm) | Peel adhesion N(fg)/W25mm | Uses |
|---|---|---|---|
| 791 | 0.13 | 14.71 (1500) | Static charge draining, grounding, For fixing static eliminators, Attachment, fixing, temporary positioning of parts, For thermal conduction, For fixing heat sink of semiconductor and electronic components, For fixing anti-static brush of office automation |
| 792 | 0.09 | 8.58 (875) | Static charge draining, grounding, For fixing static eliminators, Attachment, fixing, temporary positioning of parts, For thermal conduction, For fixing heat sink of semiconductor and electronic components |
| 795 | 0.06 | 7.50 (765) | Static charge draining, grounding, For fixing static eliminators, Attachment, fixing, temporary positioning of parts, For thermal conduction, For fixing heat sink of semiconductor and electronic components |
| 796 | 0.05 | 7.50 (765) | Static charge draining, grounding, For fixing static eliminators, Attachment, fixing, temporary positioning of parts, For thermal conduction, For fixing heat sink of semiconductor and electronic components |
| 7090 | 0.125 | 17.65 (1800) | For fixing heat sink of electronic components, semiconductor, CPU, For fixing parts with thermal conductor, For heat radiation of LED |
| 7091 | 0.108 | 15.25 (1550) | For fixing heat sink of electronic components, semiconductor, CPU, For fixing parts with thermal conductor, For heat radiation of LED |
| 7092 | 0.125 | 13.60 (1387) | For fixing heat sink of electronic components, semiconductor, CPU, For fixing parts with thermal conductor, For heat radiation of LED |
| 7093 0.25 |
0.25 | 20.0 (2040) 90°peel adhesion |
For fixing heat sink of electronic components, semiconductor, CPU, For fixing parts with thermal conductor, For heat radiation of LED |